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UV LASER MARKING MACHINE

Equipment advantages:

  1. The heat-affected zone is extremely small, avoiding deformation, damage or charring of the material to be processed, and theyield is high
  2. Applied on various materials to makeup shortcomings of fiber laser or C02 laser
  3. High photoelectric conversion rate, 355nm output wavelength, beautifulengraving effect,good touch feeling, high anti-counterfeiting effect
  4. Products are widely used in micro-machining, fine engraving of various metal and non-metal film materials

Suitable for high-end market for ultra-fine processing, such as mobile phones, chargers, data cables, pharmaceutical packages, cosmetics packages, and polymer materials surface marking. Also it can be used for marking of flexible PCB boards, dicing; micro-holes and blind holes for silicon wafers, LCDQA code marking, glassware punching, metal surface marking, plastic buttons, electronic components, gifts, communication equipment, building materials marking, etc.

Model CX-03Z/08Z/10Z
Process area 100*100mm
Laser power 3W/8W/10W optional
Laser wavelength 355nm
Laser type 808nm semiconductor pumping source
Lens Laser lens imported from US
Cooling type Professional industrial thermostat system
Marking speed 500 characters/sec
Laser energy control 0-100% software setting
Minimum font 0.1mm

 

Minimum mark line-width 0.01mm
Repeat positioning accuracy ±0.001mm
Whole power 1.5KW
Power supply AC 110V/220V ±10%,50HZ/60HZ
Working environment Temperature:1-45°C, Hum1d1ty:5-95%
Dimensions 900*1000*1600mm